

4Y9
DIMENSIONS
D 50-350mm; W 10-80mm; X 2-15mm
BONDS
MDT (plastic), MDX/MDXe (metal), MDR (ceramic)
APPLICATIONS
chip surface grinding
DIMENSIONS
D 50-350mm; W 10-80mm; X 2-15mm
BONDS
MDT (plastic), MDX/MDXe (metal), MDR (ceramic)
APPLICATIONS
chip surface grinding