14B1

DIMENSIONS
D 30-600mm (MDX/MDXe up to max. D 400mm); U 1-35mm; X 2-20mm

BOND
MDT (resin), MDX/MDXe (metal), MDR (ceramic)

APPLICATIONS
external and internal non-circular grinding, groove cutting, back off grinding, point thinning, radial corner bevel, profile grinding

3B1

DIMENSIONS
D 40-500mm (MDX/MDXe up to max. D 400mm); U 4-100mm; X 2-30mm

BOND
MDT (resin), MDX/MDXe (metal)

APPLICATIONS
external and internal non-circular grinding, groove cutting, back off grinding, point thinning, radial corner bevel, profile grinding

1B1

DIMENSIONS
D 40-500mm (MDX/MDXe up to max. D 400mm); U 4-100mm; X 2-30mm

BOND
MDT (resin), MDX/MDXe (metal), MDR (ceramic)

APPLICATIONS
external and internal non-circular grinding, groove cutting, back off grinding, point thinning, radial corner bevel, profile grinding

1V8

DIMENSIONS
D 30-75mm; U 3-10mm; 5-15mm

BOND
MDT (plastic), MDX/MDXe (metal)

APPLICATIONS
external and internal non-circular grinding, groove cutting, back off grinding

CPP

DIMENSIONS
D 150-600mm; W 6-250mm; 3-7mm

BONDS
MDT (plastic)

APPLICATIONS
face machining

3A1-SP

DIMENSIONS
D 200-400mm; U 4-5mm; X 5-6mm

BONDS
MDT (plastic)

APPLICATIONS
peel grinding

14K9

DIMENSIONS
D 100-300mm; X 10-20mm

BONDS
MDT (plastic), MDR (ceramic)

APPLICATIONS
profile grinding, relief angle grinding, chip surface grinding

12V5

DIMENSIONS
D 100-300mm; W 5-20mm; X 3-10 mm

BONDS
MDT (plastic), MDX/MDXe (metal), MDR (ceramic)

APPLICATIONS
chip surface grinding, relief angle grinding, radial grinding

12V4

DIMENSIONS
D 75-350mm; W 5-10mm; X 1-3mm

BONDS
MDT (plastic)

APPLICATIONS
chip surface grinding

12A2/60°

DIMENSIONS
D 50-300mm; W 5-20mm

BONDS
MDT (plastic), MDX/MDXe (metal), MDR (ceramic)

APPLICATIONS
clearance angle grinding, cylindrical grinding, face grinding