14B1
DIMENSIONS
D 30-600mm (MDX/MDXe up to max. D 400mm); U 1-35mm; X 2-20mm
BOND
MDT (resin), MDX/MDXe (metal), MDR (ceramic)
APPLICATIONS
external and internal non-circular grinding, groove cutting, back off grinding, point thinning, radial corner bevel, profile grinding
3B1
DIMENSIONS
D 40-500mm (MDX/MDXe up to max. D 400mm); U 4-100mm; X 2-30mm
BOND
MDT (resin), MDX/MDXe (metal)
APPLICATIONS
external and internal non-circular grinding, groove cutting, back off grinding, point thinning, radial corner bevel, profile grinding
1B1
DIMENSIONS
D 40-500mm (MDX/MDXe up to max. D 400mm); U 4-100mm; X 2-30mm
BOND
MDT (resin), MDX/MDXe (metal), MDR (ceramic)
APPLICATIONS
external and internal non-circular grinding, groove cutting, back off grinding, point thinning, radial corner bevel, profile grinding
1V8
DIMENSIONS
D 30-75mm; U 3-10mm; 5-15mm
BOND
MDT (plastic), MDX/MDXe (metal)
APPLICATIONS
external and internal non-circular grinding, groove cutting, back off grinding
CPP
DIMENSIONS
D 150-600mm; W 6-250mm; 3-7mm
BONDS
MDT (plastic)
APPLICATIONS
face machining
MOUNTING FOR AM+PZ
MACHINE TYPE
diverse
3A1-SP
DIMENSIONS
D 200-400mm; U 4-5mm; X 5-6mm
BONDS
MDT (plastic)
APPLICATIONS
peel grinding
14K9
DIMENSIONS
D 100-300mm; X 10-20mm
BONDS
MDT (plastic), MDR (ceramic)
APPLICATIONS
profile grinding, relief angle grinding, chip surface grinding
12V5
DIMENSIONS
D 100-300mm; W 5-20mm; X 3-10 mm
BONDS
MDT (plastic), MDX/MDXe (metal), MDR (ceramic)
APPLICATIONS
chip surface grinding, relief angle grinding, radial grinding
12V4
DIMENSIONS
D 75-350mm; W 5-10mm; X 1-3mm
BONDS
MDT (plastic)
APPLICATIONS
chip surface grinding